The system is ideally suited for R&D and validation workflows, enabling engineers to compare materials, evaluate interface performance, measure bulk thermal conductivity, and analyze how thermal resistance varies with pressure, temperature, and bond-line thickness.
Optimized for Thermal Characterization of
Gap fillers
Greases
Pads
Foils
Underfills
Substrates
System Specs:
- ASTM D5470-17 compliant steady-state thermal characterization
- Compact benchtop format with 42.3 × 48.3 cm² footprint and 75.2 cm height
- 50 kg system weight and 600 W power consumption
- Supports 13–25.4 mm round samples and 10–25.4 mm square samples
- Handles sample thicknesses from 0.001–40.0 mm
- Applies -300 … 300 N continuous force and -450 … 450 N short-term force
- Measures BLT with 1 µm precision
- Covers 20–150 °C sample temperature range
- Provides 1.0 mm²K/W thermal resistance resolution
- Supports automated testing varying either a thermal or mechanical parameter