The TTV200 Thermal Test Vehicle is a high-end thermal emulation platform designed to replicate the complex, non-uniform heat behavior of modern GPU architectures. With a large 52.5 × 50 mm multi-die layout and a hybrid chiplet structure, the TTV200 enables engineers to move beyond simplified thermal loads and instead work with realistic, spatially distributed power profiles at system-relevant scale.
With up to 18 independently controllable heater zones (expandable to 48 in custom configurations) and 112 integrated on-die temperature sensors, the platform delivers the level of spatial resolution required for next-generation cooling, packaging, and high-power electronics development.
Built to Reflect GPU-Scale Thermal Reality
Modern GPUs operate under extreme and highly localized power densities, driven by heterogeneous compute blocks, memory stacks, and interconnect regions. The TTV200 is engineered to reproduce this complexity in a controlled and repeatable laboratory environment.
Multiple die regions—including two primary dies and eight satellite chiplets—allow realistic modeling of distributed compute loads. Each region can be thermally driven and observed independently, enabling engineers to study coupling effects, hotspot formation, and cooling performance under conditions that closely mirror real silicon behavior.
A dense sensor network with 112 on-die RTDs, complemented by additional package-level sensors, provides deep thermal visibility across both die and substrate levels. This makes the TTV200 particularly suited for validating advanced cooling strategies where spatial gradients and transient effects dominate performance.
Performance at a Glance
Up to 7400 W total thermal load capability for extreme GPU-class testing
Up to 18 independently controllable heater zones (expandable to 48 custom)
112 integrated on-die RTD sensors + 8 package-level temperature sensors
52.5 × 50 mm multi-die chiplet architecture for system-level realism
Engineered for Next-Generation Thermal Systems
The TTV200 is designed for engineers working at the highest level of thermal and system complexity. It supports validation of advanced liquid cooling systems, cold plate architectures, vapor chamber solutions, and high-performance heat spreaders under realistic GPU-like load distributions.
It is particularly well suited for semiconductor packaging teams, GPU and AI hardware developers, automotive high-power electronics, and research institutions working on advanced thermal management strategies where accuracy, density, and scalability are critical.
Speak with a Thermal Test Specialist
From custom heater configurations to full control system integration with TCU platforms and ETB interfaces, Nanotest provides complete support for high-power thermal validation setups.
Contact us to define the right configuration for your application and integrate the TTV200 into your development workflow.